Microelectronics and Advanced Packaging Technologies Roadmap 2.0
The Semiconductor Research Corporation released its Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap 2.0.
This roadmap is a comprehensive update to the industry’s first 3D semiconductor roadmap, including contributions from over 370 experts from 132 organizations.
A new chapter on digital twins and their applications has been added, with updated content throughout.
The roadmap was funded by the U.S. Department of Commerce’s NIST and supports the CHIPS Act by providing a strategic framework for the semiconductor supply chain.
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Author’s summary: Roadmap for microelectronics and packaging technologies updated.